Interconnect, D2D, C2C / Chip to Chip SoC Catalog

www.design-reuse-china.com

从IP到片上系统以及物联网扫描上方二维码关注我们的微信号哦! IP SoC 中国2024！快来参与吧！新闻视频加入D&R 社区

Interconnect, D2D, C2C Catalog

Chip to Chip (4)

Die-to-die (29)

Intra SoC Connectivity (10)

Network Interconnect (15)

Innovative Ultra-High-Speed Chiplet Solution

Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chips as if they were all on the same bus. Chiplets, d...

Low Power Dual PHY for UCIe low cost robust Chiplets

YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's unique feature is support for standard 50V CDM chi...

Nutcracker XSR Connectivity Chiplet

Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to next generation of advanced process geometries...

NuLink - Interconnect Solution

Eliyan s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of to...

Back

业务合作

广告发布

添加产品

© 2023 Design And Reuse