Cadence and Samsung Foundry to expand 5nm automotive IP

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Cadence Design Systems has signed a multi-year agreement to expand its design IP portfolio on Samsung Foundry's SF5A 5nm automotive process technology.

www.eenewseurope.com, Jun. 14, 2023 – 

The agreement enables a complete design IP solution from Cadence with 12/56/25/10G PHY/MAC, PCI Express (PCIe) 6.0/5.0/4.0/3.1 PHY/Controller, Universal Chiplet Interconnect Express (UCIe) PHY/Controller, USB3.x PHY/Controller and a complete PHY and controller offering for GDDR6 and DDR5/4.

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The deal highlights the accelerated move to advanced 5nm and 3nm processes for automotive chips that was highlighted at TSMC's recent European Technology Summit: 3nm AI chips and 6nm microcontrollers will be key to TSMC

The Samsung agreement also includes the latest DDR5 8400+ and GDDR7 memory IP on the SF3 3nm technology, providing a future-proof migration path for generative AI/ML, hyperscale, and high-performance computing (HPC) chips. Cadence also provides full subsystem delivery with integrated PHY and controller IP to simplify integration, minimize risks, and enable faster time to market.

"Cadence and Samsung have been collaborating closely on Samsung EDA and IP ecosystem enablement for years. Through this new multi-year IP expansion plan, we further solidify our commitment to empowering joint customers with access to a complete design IP portfolio on SF5A technology as well as the leading DDR5 8400+ and GDDR7/6 solutions on SF3," said Jongshin Shin, EVP of Samsung Foundry and Head of IP Ecosystem.

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